Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

By Kim S. Siow. Journal of Electronic Materials, 2014

290 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/3726dca945064ea5d26f3de2bc7e291b353a220f

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Y. T. Lin
2. Kim S. Siow

In Mechanical Engineering

1. Y. T. Lin
2. Kim S. Siow

Citations in the corpus

• Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study (2016, methodology): “reliability of the Ag joints [4,35] (Note: laminate, sheet, film, and preform are used interchangeably in this review.”