High-temperature lead-free solders: Properties and possibilities

By Katsuaki Suganuma, Seongjun Kim, Keun-Soo Kim. 2009

329 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, General Materials Science

View Paper: https://www.semanticscholar.org/paper/2d6deaf05dfb0d0bd4560079d3dff8fc38eabfe3

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Vemal Raja Manikam
2. Kuan Yew Cheong

Citations in the corpus

• Die Attach Materials for High Temperature Applications: A Review (2011, background): “As for intermetallic formations, it was seen that three layers of TABLE VI Existing Zn Based Die Attach Solutions and Alloys [24], [42], [48] Alloying Elements Compositions of Samples Solidus Temp.”