Die Attach Materials for High Temperature Applications: A Review

By Vemal Raja Manikam, Kuan Yew Cheong. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2011

446 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/e049746cb2a45a23b8e6e0cc3580f5d3893be8ff

How researchers see this paper

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In Electrical and Electronic Engineering

1. D. Henry
2. Laurent Mendizabal
3. Alejandro G. Yepes
4. J. Doval‐Gandoy
5. Emil Levi

Citations in the corpus

• Wide Bandgap Devices in AC Electric Drives: Opportunities and Challenges (2019, background): “The coefficient of thermal expansion mismatch between base plates and the substrate, solder void formation in the die attachment and the direct bond copper to base plate bond, and parasitic effects caused by wire bonds are some of the challenges [115]-[121].”
• Survey of High-Temperature Reliability of Power Electronics Packaging Components (2015, background): “Even if some survey papers have addressed the high-temperature packaging materials [12], [13], reliability survey on the latest results of those components has not been addressed yet.”