C. Kao

Electrical and Electronic Engineering · with Ho · 2002–2006

A researcher in the Science corpus: 7 papers; trusts 1 researcher and is trusted by 1 researcher here, as inferred from the citation graph.

Subfields

• Electrical and Electronic Engineering — 35 citations into it; #15,507 of 16,539 by trust here, #6,291 by citations
• Electronic, Optical and Magnetic Materials — 10 citations into it

Whom C. Kao trusts

Their strongest outbound trust, strongest first, inferred from their citations.

1. King-Ning Tu (in Electrical and Electronic Engineering)

Who trusts C. Kao

1. Liang Zhang (in Electrical and Electronic Engineering)

Papers from C. Kao's perspective

Ordered by how strongly the researchers C. Kao trusts endorse each paper. Same corpus, a different order for every researcher.

1. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
2. Solder Joint Technology
3. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
4. Thermomigration in SnPb composite flip chip solder joints
5. Electrochemical Methods: Fundamentals and Applications
6. Transparent conducting oxide semiconductors for transparent electrodes
7. Transparent, Conductive Carbon Nanotube Films (Science)
8. Crystalline Silver Nanowires by Soft Solution Processing
9. Mechanisms of PVP in the preparation of silver nanoparticles
10. Electrode Grids for ITO Free Organic Photovoltaic Devices

Their papers

• A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni (2003) — 154 citations
• Interfacial reaction issues for lead-free electronic solders (2006) — 298 citations
• Effects of limited cu supply on soldering reactions between SnAgCu and Ni (2006) — 144 citations
• In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing (2005) — 151 citations
• Electromigration failure in flip chip solder joints due to rapid dissolution of copper (2003) — 137 citations
• Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni (2002) — 328 citations
• Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders (2002) — 201 citations