Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders

By W. Chen, C. Ho, C. Kao. 2002

201 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/f4964e224294a47097bfa78eefae7c8922d885a8

Citations in the corpus

• Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu (2009, unknown): “This differed from the reaction between Ni and the Cu-doped Sn-based solders, which was very sensitive to the Cu concentration [19-22].”