Effects of limited cu supply on soldering reactions between SnAgCu and Ni

By C. Ho, Y. W. Lin, S. Yang, C. Kao, D. Jiang. 2006

144 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/991a3c8cedd17e76d00870ddf87b8b6b6560c173