Electromigration failure in flip chip solder joints due to rapid dissolution of copper

By Y. Hu, Y. H. Lin, C. Kao, King-Ning Tu. 2003

137 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/932ecc8dbc01b6b50b57b78c9129a31d92412c82

Citations in the corpus

• Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “Hu and co-workers also reported the rapid, asymmetrical, and localized dissolution of a Cu UBM at the cathode side [52,53].”