Interfacial reaction issues for lead-free electronic solders
By C. Ho, S. Yang, C. Kao. 2006
298 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/8654c7fba9ad7ba324f0c4fcdb1b78fd5e042af4
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In Electrical and Electronic Engineering
In Mechanical Engineering
Citations in the corpus
- Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging (2018, background): “Microalloying of the copper substrate can retard the growth of the intermetallic compound of the solder joint and reduce the number of Kirkendall voids and the consumption of copper [124, 125].”