Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

By Cheng-En Ho, R. Tsai, Y. L. Lin, C. Kao. 2002

328 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/7289cf2e9e9a2dd1ea72425944ba8de008334f46