Jian-Qiang Lu

Electrical and Electronic Engineering · 2006–2009

A researcher in the Science corpus: 2 papers; trusts 7 researchers and is trusted by 0 researchers here, as inferred from the citation graph.

Subfields

Whom Jian-Qiang Lu trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. Kaustav Banerjee
  2. Iroon Polytechniou
  3. Shukri J. Souri
  4. Pawan Kapur
  5. Murali Annavaram
  6. James D. Meindl
  7. Gabriel H. Loh
  8. Krishna C. Saraswat

Papers from Jian-Qiang Lu's perspective

Ordered by how strongly the researchers Jian-Qiang Lu trusts endorse each paper. Same corpus, a different order for every researcher.

  1. 3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias (International Electron Devices Meeting)
  2. Influence of cultivation temperature on the ligninolytic activity of selected fungal strains
  3. Electrical integrity of state-of-the-art 0.13 /spl mu/m SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication (Digest. International Electron Devices Meeting,)
  4. Three-dimensional integrated circuits for low-power, high-bandwidth systems on a chip (2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177))
  5. Die Stacking (3D) Microarchitecture (Micro)
  6. Demystifying 3D ICs: the pros and cons of going vertical (IEEE Design & Test of Computers)
  7. Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs (Proceedings of the IEEE)
  8. 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration (Proceedings of the IEEE)
  9. Rationale and challenges for optical interconnects to electronic chips (Proceedings of the IEEE)
  10. AND T

Their papers