Pawan Kapur
Proceedings of the IEEE · 2001–2002
A researcher in the Science corpus: 2 papers; trusts 0 researchers and is trusted by 1 researcher here, as inferred from the citation graph.
Who trusts Pawan Kapur overall
Papers from Pawan Kapur's perspective
Ordered by how strongly the researchers Pawan Kapur trusts endorse each paper. Same corpus, a different order for every researcher.
- Full chip thermal analysis of planar (2-D) and vertically integrated (3-D) high performance ICs (International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138))
- Rationale and challenges for optical interconnects to electronic chips (Proceedings of the IEEE)
- Size-dependent resistivity of metallic wires in the mesoscopic range
- Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller
- The mean free path of electrons in metals
- Global (interconnect) warming
- Process-dependent thin-film thermal conductivities for thermal CMOS MEMS (Journal of microelectromechanical systems)
- The future of wires (Proceedings of the IEEE)
- An elementary quantum network of single atoms in optical cavities (Nature)
- Periodically poled thin-film lithium niobate microring resonators with a second-harmonic generation efficiency of 250,000%/W (Optica)