Adhesive wafer bonding

By Frank Niklaus, G. Stemme, Jian-Qiang Lu, R. Gutmann. 2006

167 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/e954961906142d233a39e03bb473910cf703b9c2

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. John E. Bowers
2. R. Baets

In Electrical and Electronic Engineering

1. John E. Bowers
2. Gunther Roelkens
3. Di Liang
4. R. Baets
5. Frank Niklaus
6. Wim Bogaerts
7. Po Dong
8. C. Doerr

Citations in the corpus

• Hybrid Integrated Platforms for Silicon Photonics (2010, background): “An extensive review of adhesive wafer bonding can be found in [29].”
• MEMS-based uncooled infrared bolometer arrays: a review (2007, background): “Heterogeneous three dimensional (3D) bolometer integration has been proposed for the integration of high-performance mono-crystalline temperature sensing bolometer materials on ROICs [48, 51-56].”