3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems

By Jian-Qiang Lu. Proceedings of the IEEE, 2009

307 citations recorded by the source corpus.

Subfields: Automotive Engineering, Computer Networks and Communications, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/40243b849484a2f80a516ea0565dc37bb47e0328