Karthik Sankaranarayanan

Electrical and Electronic Engineering · 30th Annual International Symposium on Computer Architecture, 2003. Proceedings. · 2003–2006

A researcher in the Science corpus: 5 papers; trusts 7 researchers and is trusted by 8 researchers here, as inferred from the citation graph.

Subfields

Whom Karthik Sankaranarayanan trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. Kevin Skadron
  2. Mircea R. Stan
  3. Wei Huang

Who trusts Karthik Sankaranarayanan overall

  1. Wei Huang
  2. Radu Teodorescu
  3. Kevin Skadron
  4. James Mc Donald
  5. Sunpyo Hong

Papers from Karthik Sankaranarayanan's perspective

Ordered by how strongly the researchers Karthik Sankaranarayanan trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Dynamic thermal management for high-performance microprocessors (Proceedings HPCA Seventh International Symposium on High-Performance Computer Architecture)
  2. Control-theoretic techniques and thermal-RC modeling for accurate and localized dynamic thermal management (Proceedings Eighth International Symposium on High Performance Computer Architecture)
  3. Reducing power density through activity migration (Proceedings of the 2003 International Symposium on Low Power Electronics and Design, 2003. ISLPED '03.)
  4. Temperature-aware microarchitecture (30th Annual International Symposium on Computer Architecture, 2003. Proceedings.)
  5. Energy-efficient processor design using multiple clock domains with dynamic voltage and frequency scaling (Proceedings Eighth International Symposium on High Performance Computer Architecture)
  6. Managing the Impact of Increasing Microprocessor Power Consumption
  7. Thermal Performance Challenges from Silicon to Systems
  8. Compact thermal modeling for temperature-aware design (Proceedings - Design Automation Conference)
  9. Gated-Vdd: a circuit technique to reduce leakage in deep-submicron cache memories (International Symposium on Low Power Electronics and Design)
  10. Global (interconnect) warming

Their papers