Thermal Performance Challenges from Silicon to Systems

By R. Viswanath. 2000

465 citations recorded by the source corpus.

View Paper: https://www.semanticscholar.org/paper/3e86d2e9d546689356c01866d205e455636e0cb9

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Citations in the corpus

Radiative sky cooling: fundamental physics, materials, structures, and applications (2017, unknown): “Thereby, a 10–15°C increase in temperature can halve the lifetime of microprocessors [109].”
Power and energy management for server systems (2004, background): “Power and energy management techniques that are not explicitly directed to these servers and their workloads are beyond thescope of the paper.”
Temperature-aware microarchitecture (2003, background): “This represen ts a medium-cost heat sink, with a modest savings of probably les s than $10 [29] compared to the 0.”
Heat-and-run: leveraging SMT and CMP to manage power density through the operating system (2004, background): “, boiling a coolant to remove heat) [16].”
Novel nanostructured thermal interface materials: a review (2018, background): “a more solid structure [7], eliminating pump-out, while still keeping a low modulus to absorb stress.”
Temperature-aware microarchitecture: Modeling and implementation (2004, background): “0 that might be found for typical heat sinks [Viswanath et al. 2000] in desktop and server computers.”
Adagio: making DVS practical for complex HPC applications (2009, background): “Lower frequencies require less power, and the resulting reduction in energy leads directly to reduced heat and indirectly to longer component mean time between failure [28], less energy required for cooling, and the possibility of greater component density.”
Temperature-Aware Scheduling and Assignment for Hard Real-Time Applications on MPSoCs (2008, background): “A 10 –15 difference in operating temperature can result in a 2 difference in the lifespan of a device [42].”
Impact of self-heating effect on long-term reliability and performance degradation in CMOS circuits (2006, background): “A small increase of 10 ◦C–15 ◦C in the junction temperature may result in ∼ 2× reductions in the lifespan of the device [9].”