Temperature-aware microarchitecture: Modeling and implementation
By Kevin Skadron, Mircea R. Stan, Karthik Sankaranarayanan, Wei Huang, Sivakumar Velusamy, David Tarjan. TACO, 2004
821 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Hardware and Architecture
View Paper: https://www.semanticscholar.org/paper/6681c5cecb6efb15f170786e04e05fc77820be50
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Electrical and Electronic Engineering
- Kevin Skadron
- Karthik Sankaranarayanan
- Sivakumar Velusamy
- Wei Huang
- Mircea R. Stan
- Shougata Ghosh
- Margaret Martonosi
- James Mc Donald
In Hardware and Architecture
- Karthik Sankaranarayanan
- Sivakumar Velusamy
- Wei Huang
- Kevin Skadron
- Mircea R. Stan
- Margaret Martonosi
- Gabriel H. Loh
- James Mc Donald
Citations in the corpus
- Compact thermal modeling for temperature-aware design (2004, methodology): “For example, our previous work [5] [6] presents a dynamic compact thermal model, HotSpot , only at the microarchitecture level.”
- HotSpot: a compact thermal modeling methodology for early-stage VLSI design (2006, background): “Details of the derivations and formulas of all the above thermal resistances and capacitances can be found in [7] and [21].”