Compact thermal modeling for temperature-aware design
By Wei Huang, Mircea R. Stan, Kevin Skadron, Karthik Sankaranarayanan, Shougata Ghosh, Sivakumar Velusamy. Proceedings - Design Automation Conference, 2004
355 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/d5140436720a1afa05c0c041434bfd523f697707
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Electrical and Electronic Engineering
- Margaret Martonosi
- Kevin Skadron
- James Mc Donald
- Mircea R. Stan
- Karthik Sankaranarayanan
- Sivakumar Velusamy
- Wei Huang
- Shougata Ghosh
Citations in the corpus
- Techniques for Multicore Thermal Management: Classification and New Exploration (2006, methodology): “As a component of our thermal/timing simulator, we use HotSpot version 2.0 [18, 33] which uses parameters that have been calibrated against a real chip as well as a power-trace-driven simulation capability.”
- Quantics-TT Collocation Approximation of Parameter-Dependent and Stochastic Elliptic PDEs (2010, background): “This is related to boundary condition independent modelling [25] and such problems appear in compact thermal modelling ([11]).”
- HotSpot: a compact thermal modeling methodology for early-stage VLSI design (2006, methodology): “As an example, die-level temperature estimations from HotSpot can be used as a guideline for temperature-aware design during the entire design flow [4].”