HotSpot: a compact thermal modeling methodology for early-stage VLSI design

By Wei Huang, Shougata Ghosh, Sivakumar Velusamy, Karthik Sankaranarayanan, Kevin Skadron, Mircea R. Stan. IEEE Transactions on Very Large Scale Integration (vlsi) Systems, 2006

1,108 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/167f78125336294e184773d1469f816944af7e11

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. David Tarjan
2. Kevin Skadron
3. Yuan Xie
4. Xiaobing Luo
5. Shuangchen Li
6. Gabriel H. Loh
7. Margaret Martonosi

Citations in the corpus

• A performance study of general-purpose applications on graphics processors using CUDA (2008, methodology): “HotSpot [9] is a widely used tool to estimate processor temperature based on an architectural floorplan and simulated power measurements.”
• Heat and fluid flow in high-power LED packaging and applications (2016, methodology): “However, this method relies on carefully considered approximations of the related heat transfer phenomena [101-108].”
• DRISA: A DRAM-based Reconfigurable In-Situ Accelerator (2017, methodology): “We also evaluated the power density with the Hotspot tool [43].”
• Rodinia: A benchmark suite for heterogeneous computing (2009, methodology): “HotSpot (HS) is a thermal simulation tool [13] used for estimating processor temperature based on an architectural floor plan and simulated power measurements.”