Measurement of temperature in active high-power AlGaN/GaN HFETs using Raman spectroscopy
By Martin Kuball, J. Hayes, Michael J. Uren, I. Martin, J. Birbeck, R. Balmer, B. T. Hughes. IEEE Electron Device Letters, 2002
356 citations recorded by the source corpus.
Subfields: Condensed Matter Physics, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/cf2a5ba757e393610ad33c17f7fd0c4c1933fe75
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Citations in the corpus
- Integrated micro-Raman/infrared thermography probe for monitoring of self-heating in AlGaN/GaN transistor structures (2006, methodology): “As was reported in [25] and [26], the temperature on the surface of AlGaN/GaN HFETs is higher than the average tem-”
- Electrothermal Simulation and Thermal Performance Study of GaN Vertical and Lateral Power Transistors (2013, neutral): “2261072 pure thermal models [2], [6], [7].”
- Integrated Optical and Electrical Analysis: Identifying Location and Properties of Traps in AlGaN/GaN HEMTs During Electrical Stress (2010, background): “More details on optical techniques can be found in [7] and [8].”
- Temperature measurements of semiconductor devices - a review (2004, methodology): “The spatial resolution of the Raman effect for measuring the temperature has been claimed to be 1 μm [55] and the temperature resolution 1-2 °C [56].”
- Thermal resistance calculation of AlGaN-GaN devices (2004, neutral): “One of the most accurate means, showing excellent agreement with experiment [ 14 ], of calculating thermal resistance, heat flux, and temperature is through the use of sophisticated finite-element programs.”