Markus Lutz
Electrical and Electronic Engineering · 2003–2006
A researcher in the Science corpus: 3 papers; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 12 citations into it
Whom Markus Lutz trusts
Their strongest outbound trust, strongest first, inferred from their citations.
- Liwei Lin (in Electrical and Electronic Engineering)
Papers from Markus Lutz's perspective
Ordered by how strongly the researchers Markus Lutz trusts endorse each paper. Same corpus, a different order for every researcher.
- MEMS post-packaging by localized heating and bonding
- Vacuum packaging technology using localized aluminum/silicon-to-glass bonding (Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090))
- A 12 MHz micromechanical bulk acoustic mode oscillator
- Single wafer encapsulation of MEMS devices
- A high-performance planar piezoresistive accelerometer (Journal of microelectromechanical systems)
- Thermal conduction in doped single-crystal silicon films
- Engineering MEMS Resonators With Low Thermoelastic Damping (Journal of microelectromechanical systems)
- Quality factors in micron- and submicron-thick cantilevers (Journal of microelectromechanical systems)
- Thermoelastic damping in fine-grained polysilicon flexural beam resonators
- Micromechanical "hollow-disk" ring resonators (17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest)
Their papers
- Single wafer encapsulation of MEMS devices (2003) — 181 citations
- Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators (2006) — 204 citations
- Impact of geometry on thermoelastic dissipation in micromechanical resonant beams (2006) — 138 citations