Aaron Partridge

Electrical and Electronic Engineering · 2003–2006

A researcher in the Science corpus: 4 papers; trusts 1 researcher and is trusted by 1 researcher here, as inferred from the citation graph.

Subfields

• Electrical and Electronic Engineering — 15 citations into it; #14,490 of 16,539 by trust here, #8,627 by citations

Whom Aaron Partridge trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

1. Liwei Lin

Who trusts Aaron Partridge overall

1. Jerome P. Lynch

Papers from Aaron Partridge's perspective

Ordered by how strongly the researchers Aaron Partridge trusts endorse each paper. Same corpus, a different order for every researcher.

1. MEMS post-packaging by localized heating and bonding
2. An Introduction to Microelectromechanical Systems Engineering
3. Vacuum packaging technology using localized aluminum/silicon-to-glass bonding (Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090))
4. A high-performance planar piezoresistive accelerometer (Journal of microelectromechanical systems)
5. A 12 MHz micromechanical bulk acoustic mode oscillator
6. Single wafer encapsulation of MEMS devices
7. Thermal conduction in doped single-crystal silicon films
8. Microsystem Design
9. Engineering MEMS Resonators With Low Thermoelastic Damping (Journal of microelectromechanical systems)
10. Quality factors in micron- and submicron-thick cantilevers (Journal of microelectromechanical systems)

Their papers

• Single wafer encapsulation of MEMS devices (2003) — 181 citations
• Design of Piezoresistive MEMS-Based Accelerometer for Integration with Wireless Sensing Unit for Structural Monitoring (2003) — 153 citations
• Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators (2006) — 204 citations
• Impact of geometry on thermoelastic dissipation in micromechanical resonant beams (2006) — 138 citations