An Introduction to Microelectromechanical Systems Engineering

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The reliability of microelectromechanical systems (MEMS) in shock environments (2002, background): “7 in the wet-etched structure, and at an angle near 90 in the DRIE (or wafer-bonded) structure, respectively [1], [2].”
Cure depth control for complex 3D microstructure fabrication in dynamic mask projection microstereolithography (2009, methodology): “Higher aspect ratios can be achieved using a process called deep reactive ion etching (DRIE), in which the substrate is etched to depths of hundreds of microns using ions generated in a plasma ( Maluf, 2000”
Design of Piezoresistive MEMS-Based Accelerometer for Integration with Wireless Sensing Unit for Structural Monitoring (2003, background): “This is a direct result of piezoresistive accelerometers having not been capable of keeping pace with the reduced fabrication costs associated with capacitive architectures (Maluf 2000).”
The development of micro-gyroscope technology (2009, methodology): “A micro-gyroscope which can measure angular rate or angle is a kind of device combining gyroscope technology with MEMS technology [1].”
Wireless Sensor Networks for Ecology (2005, background): “…based on molecular signatures (Caron et al. 2004) or on microchip technologies, such as MEMS (microelectromechanical systems) devices, are addressing these challenges and offer the poten- tial to produce inexpensive sensors in large quantities (Beeby et al. 2004, Maluf and Williams 2004).”