A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices

By Hui Shun Chin, Kuan Yew Cheong, A. Ismail. 2010

318 citations recorded by the source corpus.

Subfields: Ceramics and Composites, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/06b866a2a217e91e1d11f0c3a12e3683161153aa

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. D. Henry
2. Laurent Mendizabal

Citations in the corpus

• Survey of High-Temperature Reliability of Power Electronics Packaging Components (2015, background): “Silicone gels present problems during the thermal storage due their limited thermal stability [3], [8].”