Ag_3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys

By D. W. Henderson, T. Gosselin, A. Sarkhel, Sung K. Kang, W. Choi, D. Shih, C. Goldsmith, K. Puttlitz. 2002

196 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/cc1b4405cf8a9d3a1a2ab013755ca393558f15d0

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In Electrical and Electronic Engineering

1. Liang Zhang

Citations in the corpus

• Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging (2018, background): “Some large Ag3Sn IMCs have appeared in the SnAgCu solder matrix, and this Ag3Sn structure can grow rapidly during cooling [80].”