A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates
By G. Zeng, S. Xue, Liang Zhang, Li-li Gao, Wei Dai, Jiadong Luo. 2010
157 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/f75c50473db8596eade4905b8dc1ef36e635cbf4
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Electrical and Electronic Engineering
In Mechanical Engineering
Citations in the corpus
- Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging (2018, background): “Copper (Cu) is a widely used substrate material in electronic packaging due to its fine solderability and prominent thermal conductivity performance [10].”