Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

By Kazuhiro Nogita. 2010

184 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/5c0b715c4f1603cde2adbe6be76afd17f4174c06

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In Electrical and Electronic Engineering

1. Abdul Haseeb

In Mechanical Engineering

1. Abdul Haseeb

Citations in the corpus

• Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate (2013, background): “The effects of nickel, as an alloying element, on the interfacial CueSn IMC layers have been explained elsewhere [7,35,48].”