Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

By Ming-yue Xiong, Liang Zhang. Journal of Materials Science, 2018

179 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/958e6f5993bdb5b6586de0eb2c3b13b8188ec209