Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints
By Jeong-Won Yoon, Bo-In Noh, Bong-Kyun Kim, C. Shur, Seung-Boo Jung. 2009
143 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/168d1b09cff6c22145d2040c04a7e866b87d2c36
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In Electrical and Electronic Engineering
In Mechanical Engineering
Citations in the corpus
- Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate (2013, background): “The effect of nickel as an alloy addition in SAC on the interfusion coefficient of Cu3Sn layer was documented in the literature [33].”