Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates

By P. Shang, Zhi-Quan Liu, X. Pang, Dian‐sen Li, J. Shang. 2009

137 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/0f885e944d9412a78e4b513265c6c8618e447ce5

How researchers see this paper

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In Electrical and Electronic Engineering

1. Abdul Haseeb

In Mechanical Engineering

1. Abdul Haseeb

Citations in the corpus

• Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate (2013, background): “[40] determined that the interfusion coefficient for Cu6Sn5 and Cu3Sn of the CueSn sample annealed at 190 C were 8.”