Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate
By S. Tay, Abdul Haseeb, M. Johan, Paul Munroe, M. Quadir. 2013
140 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/3ff21d99f76742bf5f6cca37ca7593ed9cc266a7
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In Electrical and Electronic Engineering
In Mechanical Engineering
Citations in the corpus
- Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging (2018, background): “[44] reported that Ni nanoparticles affect the growth rate of the interfacial IMC layer during reflow and aging.”