Review Article: Effect of alloying elements on properties and microstructures of SnAgCu solders

By Li-li Gao, S. Xue, Liang Zhang, Z. Sheng, F. Ji, Wei Dai, Sheng-lin Yu, G. Zeng. 2010

160 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/4785f003610f0a40961782a28f7185130b21c91e