Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate

By W. Choi, Hyuck-Mo Lee. 2000

199 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/750530dab0dd5137324cae9b7b73f5e6d197b6a2

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In Electrical and Electronic Engineering

1. Liang Zhang

In Mechanical Engineering

1. Liang Zhang

Citations in the corpus

• Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging (2018, background): “However, the existence of Ag3Sn, Cu6Sn5 and Bi-rich particles on the Cu6Sn5 grain boundary retarded the diffusion of Cu and Sn atoms through the Cu6Sn5 IMC layer, thus suppressing the growth rate of the IMCs [64].”