Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)
By Xi Liu, Qiao Chen, Pradeep Dixit, Ritwik Chatterjee, R. Tummala, S. Sitaraman. Electronic Components and Technology Conference, 2009
178 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/a81cee1d7f84ccd845b63b8d877a95d3b2bda1c7
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In Biomedical Engineering
In Electrical and Electronic Engineering
Citations in the corpus
- Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects (2011, methodology): “To assess the thermomechanical reliability of TSV structures, the driving forces for both cohesive and interfacial crack growths were calculated based on fracture mechanics [12], [13].”