The mean free path of electrons in metals
By E. Sondheimer. 2001
2,474 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials
View Paper: https://www.semanticscholar.org/paper/91de4197299d939c438be6a6840b60db3b5b9882
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In Electrical and Electronic Engineering
In Electronic, Optical and Magnetic Materials
- Pietro Gambardella
- Kaustav Banerjee
- J. Sinova
- A. Thiaville
- Hong Li
- Chuan Xu
- G. Hilton
- Navin Srivastava
In Mechanics of Materials
Citations in the corpus
- Scaling analysis of multilevel interconnect temperatures for high-performance ICs (2005, background): “I. INTRODUCTION ACCURATE estimates of multilevel interconnect temper-atures are necessary for interconnect performance and reliability assessment in high-performance very large-scale integrated (VLSI) circuits [1]–[3].”
- Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects (2009, methodology): “Typically, the CNT diameter (< 40 nm) is much smaller than its classical skin depth (defined as δCSE = √ 2ρeff/μω [124] where ρeff is the effective resistivity) when frequency is below 100 GHz.”