Wim Dehaene
Electrical and Electronic Engineering · 2005–2017
A researcher in the Science corpus: 5 papers; trusts 2 researchers and is trusted by 1 researcher here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 13 citations into it; #13,583 of 16,539 by trust here, #10,438 by citations
Whom Wim Dehaene trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Who trusts Wim Dehaene overall
Papers from Wim Dehaene's perspective
Ordered by how strongly the researchers Wim Dehaene trusts endorse each paper. Same corpus, a different order for every researcher.
- Deep Learning
- Origami: A Convolutional Network Accelerator
- Eyeriss: An Energy-Efficient Reconfigurable Accelerator for Deep Convolutional Neural Networks
- A 0.3–2.6 TOPS/W precision-scalable processor for real-time large-scale ConvNets
- 3D stacked IC demonstration using a through Silicon Via First approach (2008 IEEE International Electron Devices Meeting)
- 8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology (IEEE Journal of Solid-State Circuits)
- The impact of intrinsic device fluctuations on CMOS SRAM cell stability (IEEE J. Solid State Circuits)
- Three-dimensional integrated circuits (IBM Journal of Research and Development)
- Stable SRAM cell design for the 32 nm node and beyond (Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005.)
- Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits (Proceedings of the IEEE)
Their papers
- 14.5 Envision: A 0.26-to-10TOPS/W subword-parallel dynamic-voltage-accuracy-frequency-scalable Convolutional Neural Network processor in 28nm FDSOI (2017) — 400 citations
- Energy efficiency of the IEEE 802.15.4 standard in dense wireless microsensor networks: modeling and improvement perspectives (2005) — 307 citations
- Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs (2010) — 603 citations
- Read Stability and Write-Ability Analysis of SRAM Cells for Nanometer Technologies (2006) — 481 citations
- Design Issues and Considerations for Low-Cost 3-D TSV IC Technology (2010) — 313 citations