Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

By G. V. D. Plas, P. Limaye, Igor Loi, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti and 27 more. IEEE Journal of Solid-State Circuits, 2010

313 citations recorded by the source corpus.

Subfields: Automotive Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/047e932a9fe101d77e2d684c224e4f13da5e94bd