S. Luo
IEEE transactions on components and packaging technologies · with Calata · 2010
A researcher in the Science corpus: 1 paper; trusts 2 researchers and is trusted by 0 researchers here, as inferred from the citation graph.
Whom S. Luo trusts
Their strongest outbound trust, strongest first, inferred from their citations.
- Guo-Quan Lu (in Electrical and Electronic Engineering)
- J. Bai (in Electrical and Electronic Engineering)
Papers from S. Luo's perspective
Ordered by how strongly the researchers S. Luo trusts endorse each paper. Same corpus, a different order for every researcher.
- Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (IEEE transactions on components and packaging technologies)
- Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly (IEEE transactions on device and materials reliability)
- Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
- High-temperature electronics - a role for wide bandgap semiconductors? (Proceedings of the IEEE)
- Void induced thermal impedance in power semiconductor modules: some transient temperature effects (Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248))
- Thermal behavior of silver nanoparticles for low-temperature interconnect applications
- Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments (IEEE Aerospace Conference. Proceedings)
- Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
- Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
- Power transfer capability and bifurcation phenomena of loosely coupled inductive power transfer systems (IEEE transactions on industrial electronics (1982. Print))