Gary Yama

Electrical and Electronic Engineering · 2003–2006

A researcher in the Science corpus: 3 papers; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.

Subfields

Whom Gary Yama trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. Liwei Lin

Papers from Gary Yama's perspective

Ordered by how strongly the researchers Gary Yama trusts endorse each paper. Same corpus, a different order for every researcher.

  1. MEMS post-packaging by localized heating and bonding
  2. Vacuum packaging technology using localized aluminum/silicon-to-glass bonding (Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090))
  3. A high-performance planar piezoresistive accelerometer (Journal of microelectromechanical systems)
  4. A 12 MHz micromechanical bulk acoustic mode oscillator
  5. Single wafer encapsulation of MEMS devices
  6. Thermal conduction in doped single-crystal silicon films
  7. Micromechanical "hollow-disk" ring resonators (17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest)
  8. Engineering MEMS Resonators With Low Thermoelastic Damping (Journal of microelectromechanical systems)
  9. Quality factors in micron- and submicron-thick cantilevers (Journal of microelectromechanical systems)
  10. Energy dissipation in submicrometer thick single-crystal silicon cantilevers

Their papers