Ho-Ming Tong
Electrical and Electronic Engineering · 2010
A researcher in the Science corpus: 1 paper; trusts 1 researcher and is trusted by 1 researcher here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 12 citations into it; #16,285 of 16,539 by trust here, #15,217 by citations
- Electronic, Optical and Magnetic Materials — 8 citations into it; #2,823 of 2,886 by trust here, #2,777 by citations
Whom Ho-Ming Tong trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Who trusts Ho-Ming Tong overall
Papers from Ho-Ming Tong's perspective
Ordered by how strongly the researchers Ho-Ming Tong trusts endorse each paper. Same corpus, a different order for every researcher.
- Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
- Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
- Thermomigration in SnPb composite flip chip solder joints
- Electromigration in Sn-Pb solder strips as a function of alloy composition
- Six cases of reliability study of Pb-free solder joints in electronic packaging technology
- Solder Joint Technology
- Theory of Elasticity
- International Technology Roadmap for Semiconductors 2003の要求清浄度について － シリコンウエハ表面と雰囲気環境に要求される清浄度, 分析方法の現状について －
- Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps (IEEE Transactions on Advanced Packaging)
- Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV) (Electronic Components and Technology Conference)
Their papers
- Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints (2010) — 285 citations