Z. Cai

Electrical and Electronic Engineering · with Lall · 2008–2012

A researcher in the Science corpus: 2 papers; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.

Subfields

Whom Z. Cai trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. J. Suhling
  2. Pradeep Lall

Papers from Z. Cai's perspective

Ordered by how strongly the researchers Z. Cai trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Reliability of the aging lead free solder joint (Electronic Components and Technology Conference)
  2. Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength
  3. Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys
  4. Effect of thermal aging on board level drop reliability for Pb-free BGA packages (2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546))
  5. Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders
  6. The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints (2007 Proceedings 57th Electronic Components and Technology Conference)
  7. Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity
  8. The effects of aging temperature on SAC solder joint material behavior and reliability (Electronic Components and Technology Conference)
  9. Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
  10. Effect of simulation methodology on solder joint crack growth correlation (2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070))

Their papers