Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders

By I. Dutta, D. Pan, R. A. Marks, S. Jadhav. 2005

171 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/642b5cc782e706a60c0fba874df3a2f8b3ca248c

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Pradeep Lall
2. J. Suhling
3. Z. Cai
4. T. Bieler

In Materials Chemistry

1. T. Bieler

In Mechanical Engineering

1. Pradeep Lall
2. T. Bieler
3. J. Suhling

Citations in the corpus

• Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints (2008, background): “Coarsening of precipitates with cycling results in a reduction in strength [26]–[28].”
• The effects of aging temperature on SAC solder joint material behavior and reliability (2008, methodology): “Comparisons of the Alloys at Each Aging Temperature In prior investigations, it has been observed that lowering of the silver content of a SAC alloy leads to increases in the creep rate [27, 31].”