Effect of thermal aging on board level drop reliability for Pb-free BGA packages
By T. Chiu, K. Zeng, R. Stierman, D. Edwards, K. Ano. 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004
258 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/82ed92b111895508e47eba6e95197eab2dba0e18
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In Electrical and Electronic Engineering
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Citations in the corpus
- BGA brittle fracture - alternative solder joint integrity test methods (2005, background): “BGA Solder Joint Brittle Fracture Interfacial voids associated with BGA solder joint brittle fracture are most commonly observed with BGA packages using electroless nickel, immersion gold (ENIG) plated substrates (Figure 6) [1,2]; however, recent studies of devices using SnAgCu or SnPb solder over C”
- The effects of aging temperature on SAC solder joint material behavior and reliability (2008, background): “Several studies have been performed on the degradation of BGA ball shear strength with elevated temperature aging at 125 C or 150 C [42-46].”
- The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints (2007, background): “In addition, Hasegawa, etal.[34]measured elastic modulus reductions withaging bytesting thin solder wires, while Chiu andco-workers [ 38 ]foundsignificant reductions indrop reliability during elevated temperature aging.”
- Reliability of the aging lead free solder joint (2006, background): “The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments [11, 13-14, 20-21, 25-39].”