The effects of aging temperature on SAC solder joint material behavior and reliability

By Yifei Zhang, Z. Cai, J. Suhling, Pradeep Lall, M. Bozack. Electronic Components and Technology Conference, 2008

144 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, General Materials Science, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/77561973ffc3e879ce4e3f9c4da1c2a9ce720078

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Pradeep Lall
2. J. Suhling
3. Z. Cai

In General Materials Science

1. Pradeep Lall
2. J. Suhling

In Mechanical Engineering

1. Pradeep Lall
2. J. Suhling

Citations in the corpus

• Determination of Anand constants for SAC solders using stress-strain or creep data (2012, methodology): “We have extensive stress-strain data for SAC lead free and Sn-Pb Solders [23-28], and have demonstrated the model in eq.”