Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

By K. Kim, S. Huh, K. Suganuma. 2002

384 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/2a380e7dc3a897ab0307e1905d470c2fa8b2d5c8

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Pradeep Lall
2. J. Suhling
3. Z. Cai

In Mechanical Engineering

1. Pradeep Lall
2. J. Suhling

Citations in the corpus

• Reliability of the aging lead free solder joint (2006, background): “Solder uniaxial samples haven been fabricated by machining of bulk solder material [1-6], or by melting of solder paste in a mold [7-15].”
• The effects of aging temperature on SAC solder joint material behavior and reliability (2008, background): “Solder uniaxial samples haven been fabricated by machining of bulk solder material [1-8], or by melting of solder paste in a mold [9-18].”
• The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints (2007, background): “Solder uniaxial samples haven been fabricated by machining of bulk solder material [1-6], or by melting of solder paste in a mold [7-15].”