Reliability of the aging lead free solder joint

By Hongtao Ma, J. Suhling, Pradeep Lall, M. Bozack. Electronic Components and Technology Conference, 2006

167 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, General Materials Science

View Paper: https://www.semanticscholar.org/paper/0ff4e24c7a0c15f50c204c1fa2c3755e7a017670

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Pradeep Lall
2. J. Suhling
3. Z. Cai

In General Materials Science

1. Pradeep Lall
2. J. Suhling

Citations in the corpus

• The effects of aging temperature on SAC solder joint material behavior and reliability (2008, methodology): “However, significant changes occur even with aging at room temperature [13, 15-16, 23-24, 33-41, 48].”
• The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints (2007, background): “Our earlier study for room temperature aging showed that the creep resistance of SAC405 was better than SAC305 at all aging times [40].”