Effect of simulation methodology on solder joint crack growth correlation

By R. Darveaux. 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000

581 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/0caeb25ecb35cdab9f8cecba6ab72fcc1e6c644c

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Pradeep Lall
2. J. Suhling
3. N. Singh
4. M.N. Islam

In Mechanical Engineering

1. Pradeep Lall
2. J. Suhling
3. N. Singh
4. M.N. Islam

Citations in the corpus

• Model for BGA and CSP reliability in automotive underhood applications (2004, methodology): “Two data sets have been plotted (a) Darveaux’s data set from [3] (b) center for advanced electronics (CAVE) data.”