Determination of Anand constants for SAC solders using stress-strain or creep data

By M. Motalab, Z. Cai, J. Suhling, Pradeep Lall. Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012

169 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/c07bbfdd21530baaab7782024a9290df8cfd3e4b