Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength

By J. Pang, T. H. Low, B. Xiong, Xu Luhua, C. C. Neo. 2004

214 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/12ac4e582c656efb500fe0740ec003815e3ab06d

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Pradeep Lall
2. J. Suhling
3. Z. Cai

In Mechanical Engineering

1. Pradeep Lall
2. J. Suhling

Citations in the corpus

• The effects of aging temperature on SAC solder joint material behavior and reliability (2008, background): “However, significant changes occur even with aging at room temperature [13, 15-16, 23-24, 33-41, 48].”
• Reliability of the aging lead free solder joint (2006, background): “The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments [11, 13-14, 20-21, 25-39].”
• The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints (2007, background): “Other investigators haveattempted toextract constitutive properties ofsolders by directly loading [5, 16-23 ] or indenting [24] actual solder joints (e.g.”