The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints

By Hongtao Ma, J. Suhling, Yifei Zhang, Pradeep Lall, M. Bozack. 2007 Proceedings 57th Electronic Components and Technology Conference, 2007

166 citations recorded by the source corpus.

View Paper: https://www.semanticscholar.org/paper/b51bb5369d189c461312abab40752d15ef804d98

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. M. Motalab
2. Z. Cai
3. Yifei Zhang
4. J. Suhling
5. Pradeep Lall
6. M. Bozack
7. Michael G. Pecht

Citations in the corpus

• Determination of Anand constants for SAC solders using stress-strain or creep data (2012, methodology): “We have extensive stress-strain data for SAC lead free and Sn-Pb Solders [23-28], and have demonstrated the model in eq.”
• The effects of aging temperature on SAC solder joint material behavior and reliability (2008, methodology): “As in our prior work [48-49], the creep rate data have been fit with a combination of power law and linear models to illustrate evolution of the creep rate with aging time.”