Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity

By I. Shohji, T. Yoshida, Takehiko Takahashi, S. Hioki. 2004

203 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/f0a459e866e0ee4db6880284067dda193f434732

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Pradeep Lall
2. J. Suhling
3. Z. Cai

In Mechanical Engineering

1. Pradeep Lall
2. J. Suhling

Citations in the corpus

• The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints (2007, background): “Solder uniaxial samples haven been fabricated by machining of bulk solder material [1-6], or by melting of solder paste in a mold [7-15].”
• Reliability of the aging lead free solder joint (2006, background): “Solder uniaxial samples haven been fabricated by machining of bulk solder material [1-6], or by melting of solder paste in a mold [7-15].”
• The effects of aging temperature on SAC solder joint material behavior and reliability (2008, background): “Solder uniaxial samples haven been fabricated by machining of bulk solder material [1-8], or by melting of solder paste in a mold [9-18].”